MULTICHANNEL DIMMING CONTROLLER MODULE DISASSEMBLY/ASSEMBLY
a. Clean removed and attaching parts and surfaces (para 1.47).
Unless otherwise specified, the following inspection procedures apply to all circuit card mounting plates,
brackets (removed and attached) and standoffs.
a. Check for cracks. None allowed.
b. Check removed and attaching parts for damage (para 9.61).
c. Check removed and attaching parts for corrosion (para 1.49).
d. Check for nicks, scratches, and gouges (para 9.61).
e. Check for distortion or deformation (para 9.61).
f. Check standoffs for stripped, crossed, or flattened threads (para 9.61).
g. Check attached brackets for elongated screw holes (para 9.61).
h. Check removed brackets for loose or damaged clinch nuts (para 9.61).
i. Check wires and wire bundles for cracked, broken, or burned insulation (para 9.61).
j. Check wires and wire bundles for missing or broken tie wraps, chafing, wear, cuts and breaks (para
k. Check wiring and electronic components for cracked, loose, or cold solder joints (para 9.61).
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