TM 1-1520-238-23
9-232
9.65.
PILOT EXT LT/INTR LT PANEL SEMICONDUCTOR DEVICE CR1, CR2, CR3, CR5, CR7, CR8, OR
CR9 REPLACEMENT (AVIM) – continued
9.65.3. Removal
a. Remove component board A2 (1) from pilot
EXT LT/INTR LT panel (2).
(1) Remove three screws (3), lockwashers (4),
and washers (5).
(2) Remove board (1) and three spacers (6).
WARNING
Soldering iron can cause severe
burns to personnel and start fires.
Observe all safety precautions when
using soldering iron. If injury occurs,
seek medical aid.
CAUTION
Identify diode direction during removal for
proper polarity during installation. Acci-
dental polarity reversal will damage semi-
conductor
device
and/or
other
components.
b. Remove semiconductor device (7) from com-
ponent board A2 (1) or A1 (8).
(1) Identify direction of semiconductor (7).
(2) Desolder semiconductor (7) from two termi-
nals
(9).
Use
soldering
iron
(TM 55-1500-323-24).
(3) Remove and discard semiconductor (7).
9.65.4. Cleaning
a. Clean removed and attaching parts (para
1.47).
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