TM 1-1520-238-23
9-312
9.84.
CPG INTR LT PANEL SEMICONDUCTOR DEVICE CR1 OR CR2 REPLACEMENT
(AVIM) – continued
9.84.3. Removal
WARNING
Soldering iron can cause severe
burns to personnel and start fires.
Observe all safety precautions when
using soldering iron. If injury occurs,
seek medical aid.
CAUTION
Identify semiconductor device direction
during removal for proper polarity during
installation. Accidental polarity reversal
will damage semiconductor device and/
or other components.
a. Remove semiconductor device (1) from cir-
cuit card assembly A1 (2).
(1) Identify direction of semiconductor (1).
(2) Desolder semiconductor (1) from two termi-
nals
(3).
Use
soldering
iron
(TM 55-1500-323-24).
(3) Remove and discard semiconductor (1).
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