TM 1-1520-238-23
9-313
9.84.
CPG INTR LT PANEL SEMICONDUCTOR DEVICE CR1 OR CR2 REPLACEMENT
(AVIM) – continued
9.84.4. Cleaning
a. Clean removed and attaching parts (para
1.47).
9.84.5. Inspection
a. Check removed and attaching parts for dam-
age (para 9.61).
b. Check wires and terminals for wear, cracks,
and cuts (para 9.61).
c. Check removed and attaching parts for corro-
sion (para 1.49).
9.84.6. Installation
WARNING
Soldering iron can cause severe
burns to personnel and start fires.
Observe all safety precautions when
using soldering iron. If injury occurs,
seek medical aid.
a. Install new semiconductor (1) on circuit card
assembly A1 (2).
(1) Install semiconductor (1) in direction pre-
viously identified.
(2) Solder semiconductor (1) to two terminals (3).
Use soldering iron and solder (item 189,
App F) (TM 55-1500-323-24).
b. Inspect (QA).
c. Install CPG INTR LT panel relay R1 and socket
XK1 removed (para 9.89).
END OF TASK
M04-5078-3
2
3
3
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