TM 1-1520-238-23
9-524
9.136.
MASS TERMINATION CONNECTOR (MTC) WITH SHIELD BUS (1 OR 2 INCH) REPAIR continued
0.125 INCH
SOLDER TERMINAL OVERLAP (MAXIMUM)
STRIPPED END OF WIRE MUST BE IN CUPPED
AREA OF WAFER TERMINAL, AND MUST NOT
EXTEND BEYOND CUPPED AREA.
CONDUCTOR NOT TO EXTEND
BEYOND THIS POINT
PROPER POSITION OF WIRE ON WAFER AND BUSBAR TERMINAL
NOTE: INSULATION SLEEVE NOT SHOWN FOR
CLARITY
BACK OF
WAFER
WIRE POSITION
WIRE END MUST BE POSITIONED IN TERMINAL AS SHOWN.
REJECT
ACCEPT
ACCEPT
ACCEPT
REJECT
WIRE INSULATION OVERLAP
WIRE INSULATION MUST NOT OVERLAP
WAFER TERMINAL.
WIRE INSULATION NOT TO
EXTEND BEYOND TERMINAL
SOLDER TERMINAL OVERLAP (MINIMUM)
STRIPPED END OF WIRE MUST OVERLAP
TERMINAL AT LEAST 0.080 INCH.
0.080 INCH, MIN.
0.040 INCH MIN.
WAFER END SLEEVE OVERLAP
WAFER END OF SHRINKABLE SLEEVE MUST
BE WITHIN 0.040 INCH OF WAFER BODY.
0.040 INCH, MAX.
WIRE END SLEEVE OVERLAP
SHRINKABLE SLEEVE MUST OVERLAP WIRE
INSULATION AT LEAST 0.040 INCH.
BUSBAR TERMINAL
0.02 INCH, MIN.
BUSBAR SHIELD OVERLAP
EACH CABLE SHIELD MUST OVERLAP ONE
BUSBAR TERMINAL BY AT LEAST 0.20 INCH.
M04-3066-29
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